MONOCRYSTALLINE SILICON CAN BE FUN FOR ANYONE

Wire-saw wafer slicing is amongst the key manufacturing technologies for industrial crystalline silicon PV cells, and improvements in wafer slicing technological know-how have resulted in a discount in raw wafer thickness from 370 μm to 180 μm since 1997 for Sharp industrial polycrystalline-silicon cells (Figure six). To introduce wafers thinner